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Sockets by ANDON ELECTRONICS CORP.
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ANDON ELECTRONICS provides interconnection components that help companies to cost effectively protect, assemble, test and replace their semiconductor devices.
ANDON’s ISO 9001 certified facility offers leading edge automated interconnect assembly capabilities, tooling, stamping, high temperature molding and screw machine products. The result is a line of products like our patented Rollerball® Socket SMD technology and patented LCC Socket that brings true problem solving product process innovation and cost savings to the industry.
ANDON pioneered many of the innovative, high-reliability interconnects for military, aerospace and commercial applications that have become industry standards.
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Ball Grid Array Sockets and Mini PGA Sockets
ANDON's BGA Sockets and Adapters provide an ideal method for mounting ball grid array devices onto a PCB. The device is soldered to the adapter, greatly simplifying solder verification and testing. The device/adapter assembly then plugs into the BGA socket which is permanently soldered to the PCB. The BGA adapter is offered with either flat or countersunk heads. Our BGA sockets can be surface of thru-hole mounted. Socket insulators are made of FR-4 to withstand convection or IR soldering. ANDON BGA sockets and adapters are available in virtually any size or configuration, using off the shelf or custom designed screw machined terminals.
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Carrier Sockets
Ideally suited for "pick and place," ANDON carrier sockets provide a convenient way to load groups of receptacles onto a PCB, reducing profile by eliminating the need for an insulator. Available in many configurations, ANDON's "rigid" carrier pin assemblies offer significant advantages over "flexible" carriers. Individual receptacles remain properly aligned during insertion and soldering. After soldering, the rigid pin carrier is removed and can be recycled.
Overview about the available Carrier sockets
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Closed Frame DIP Sockets
ANDON has many versions of closed frame DIP Sockets, utilizing our famous High-Rel multi-finger contact. The closed frame DIP sockets include varieties with and without mounting holes, surface mount, shrink DIP, crystal & relay, zig zag, board to board and raised interconnects.
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Fuse Sockets
For many electronic applications, fuse replacement is common. But fuse replacement can involve risk of damage to the PCB loaded with expensive components, especially while being soldered or desoldered. ANDON fuse sockets offer a quick and easy answer. They are available in a variety of configurations for thru-hole or SMD, including 2-pin SIPS, as well as high temperature SIP and TO-5 sockets. The standard SIP socket features an insulator made of glass filled PBT or Black Nylon 46. Our high temperature SIP and TO-5 sockets are made with molded plastic UL94V-O. All fuse sockets feature High-Rel BeCu multi-finger contacts.
List of the available types of fuse sockets
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Sockets for Image Sensors
ANDON supplies a large number of sockets for various image sensors. At present ANDON can supply sockets for image sensors by ATMEL, DALSA, FAIRCHILD IMAGING, HAMAMATSU, MARCONI, MICRON, MOTOROLA, NEC, PERIPHERAL IMAGING, PHILIPS, SITE, SONY, TI and TOSHIBA. Sockets for sensors by other manufacturers are under construction.
You can find a list of suitable sockets for your image sensor in our comparison table for image sensors.
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Laminate Wafer Sockets (No Circuitry)
Combine the quality of a precision socket with the reliability and versatility of a glass epoxy insulator. Sockets in this series are available in all standard DIP and QUIP styles, and in any configuration that can be drilled and routed.
Insulator meets or exceeds military standards for shock and vibration
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LCC Sockets
These sockets are only available from ANDON ELECTRONICS CORPORATION (US-Patent #5,588,847). A unique design avoids cracking of solder joints and ceramic substrate of sensitive components.
Modern LCC image sensors are e.g. packaged with up to 100
castellations (contacts). The ceramic substrate packaging presents new
challenges for RoHS high temperature soldering.
Historically, image sensors are soldered directly on the printed
circuit board (PCB). LCC image sensors require longer soldering times
for RoHS high temperature solders. Here the ceramic substrate expands
while the solder joint is fixed which can lead to cracks.
The LCC sockets by ANDON can here offer even more advantages:
- Avoid color array high temperature soldering damage.
- Avoid electrostatic discharge (ESD) production line problems.
- Avoid cleaning solutions clouding glass cover.
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LED Sockets
LED Sockets provides the user with an extremely flexible and a highly
reliable solution to any LED socketing problems.
- Precision screw machine outer sleeve incorporates an entirely closed
bottom which yields 100% protection against solder wicking into the contact
area.
- Available in 6 to 40 pin dip configurations.
List of the available types>
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Open Frame DIP Sockets
ANDON has many versions of open frame DIP Sockets, utilizing our famous High-Rel multi-finger contact. The open frame Dip Sockets range from low profile and ultra low profile to surface mount, shrink DIP, component adapter / headers, as well as varieties with raised interconnects and crossbars.
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Pin Grid Array Sockets and Adapters
ANDON Pin Grid Array Sockets and PGA Adapters are perfect for high pin count microprocessors. ANDON offers the widest selection of standard footprints, from 5x5 to 26x26, as well as custom designed PGA Sockets. ANDON PGA Sockets offer a choice of insertion and extraction forces, including ANDON's exclusive 1 ounce ultra low force contact. Standard insulators are made of high temp. Nylon 46, suitable for IR, convection, and wave soldering. Custom PGA sockets are available with insulators made of thick glass epoxy FR4 or polyimide. Many terminals and pin lengths are available.
List of the available types
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PLCC Sockets
ANDON offers a wide variety of thru-hole and SMD PLCC sockets to accept
JEDEC type substrates. For High-Rel, high shock and high vibration
applications, ANDON offers PLCCs with edge wipe contacts made of flat heavy gauge copper alloy. For low cost computer applications, ANDON utilized face wipe contacts made of rolled-leaf copper alloy. All sockets use UL94V-O insulators. PLCC sockets are available in tubes, trays or tape and reel.
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SIP Sockets
Utilizing our famous High-Rel multi-finger contact, ANDON offers many versions of SIP sockets. The large selection of SIP Sockets include adapters, solid and snap-off packages, board to board, pin headers and pin receptacles.
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SMD Floating Terminal Sockets
Pin sockets with virtually any DIP or PGA footprint can be supplied with
unique floating terminals that compensate for uneven PCB surfaces,
eliminating coplanarity problems. Floating pin sockets are available in
open frame DIP sockets, closed frame DIP (with and without mounting holes)
and PGA versions for "pick and place" equipment. They are offered in a wide
selection of terminals and contact size.
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SMD Gull-Wing and "J" Lead Sockets
ANDON surface mount gull wing and "J" lead DIP sockets are ideally suited for "pick and place." Our gull wing sockets provide maximum strength solder joints as well as easy in-circuit testing. ANDON gull wind DIP sockets are available in a wide variety of configurations, including open and solid frame varieties. ANDON "J" lead DIP sockets are specially designed for soldering to existing footprints. Both gull wing and "J" lead DIP sockets are available with insulators made of molded plastic UL94V-O or blue FR-4 epoxy, suitable for IR or convection soldering. All sockets feature High-Rel 4-finger socket contacts.
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Tadiran Battery Sockets
ANDON offers a growing family of sockets that permit quick and reliable battery replacement. The battery socket can be production soldered to the PCB, avoiding the need to hand solder batteries in place. Use of a battery socket also eliminates desoldering, blistering or delaminating of the PCB when the battery needs replacement. Our battery sockets feature molded clips that prevent the battery from being dislodged by shock and vibration. ANDON battery sockets provide quick and reliable solutions for critical applications such as CMOS memory back-up, and primary power for portable or remote equipment.
List of the available types
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Last updated: 12/10/2010
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